CLAY, N.Y. — Micron Technology, Inc. (NASDAQ: MU) on Wednesday said it’s planning to break ground on Friday Jan. 16 on work to construct its upcoming, massive semiconductor-manufacturing campus in the town of Clay.
The planned ceremony follows an environmental review and necessary permit approvals. Micron says it is now set to begin ground preparation and construction at the site.
The up to $100 billion project will be home to the most advanced memory manufacturing in the world and will help meet the growing demands of the AI (artificial intelligence) systems that are “central to the modern economy,” Micron contended. With up to four fabs (fabrication plants), it will be the largest semiconductor facility in the U.S., the Boise, Idaho–based firm noted.
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Sanjay Mehrotra, chairman, president, and CEO of Micron Technology, and other top executives will join with officials from the Trump administration, Congress, and New York state and local government, as well as distinguished business leaders and members of the community for the ceremony. It’ll be followed by a celebration program at Syracuse University’s National Veterans Resource Center where executives and officials will provide remarks.
“Breaking ground at Micron’s New York megafab is a pivotal moment for Micron and the United States,” Mehrotra said in the announcement. “As the global economy enters the AI era, leadership in advanced semiconductors will be the cornerstone in innovation and economic prosperity. Our investments and progress solidify our position as the only United States manufacturer of memory.”
