ENDICOTT — Endicott Interconnect Technologies, Inc. (EI) has promoted Rajinder Rai to chief technology officer at the Endicott–based provider of electronic packaging and solutions.
In his new position, Rai reports to EI President and CEO James McNamara, Jr. and is responsible for monitoring new technologies, overseeing the selection of research projects, generating a technology road map and ensuring its progress, and assessing the potential of new product introduction.
Rai most recently served as vice president of engineering at EI and has 16 years of experience in the high-tech electronics industry. He replaces EI’s former chief technology officer, Voya Markovich, who retired Sept. 28.
“Raj has demonstrated his sound knowledge of advanced electronics materials and packaging process development and new product introduction,” McNamara said in a release. “His combination of advanced degrees and knowledge of science, leading and managing key technical projects, activities in a highly creative environment and then converting those developments into commercialized products for market, has positioned him for this new role as EI’s chief technology officer.”
Rai holds a bachelor’s degree in materials science and engineering from the University of Notre Dame and a master’s degree in materials science from Stevens Institute of Technology. Rai holds six U.S. patents and has authored more than 25 technical papers over the course of his career.
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